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Japan approves chip development project with Taiwan's TSMC

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From: m...@m.com (World90)
Newsgroups: soc.culture.china
Subject: Japan approves chip development project with Taiwan's TSMC
Date: Tue, 1 Jun 2021 15:47:59 -0400
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by: World90 - Tue, 1 Jun 2021 19:47 UTC

Hello,

I invite you to read how USA Intel company invented an entirely new
insulation material to help dissipate heat in there new 3D packaging
technology that stacks logic chips atop one another and we call the new
Intel CPU "Lakefield" 3D Chip, read more here to notice it:

https://www.wired.com/story/intel-lakefield/

And Taiwan's TSMC company and Japan want to do the same and there
research will focus in particular on tech for 3D chip assembly, allowing
the creation of components and chips that are more dense but still
small, read carefully the following news so that to notice it:

Japan approves chip development project with Taiwan's TSMC

https://techxplore.com/news/2021-06-japan-chip-taiwan-tsmc.html

Thank you,
Amine Moulay Ramdane.

A dead man cannot bite. -- Gnaeus Pompeius (Pompey)

interests / soc.culture.china / Japan approves chip development project with Taiwan's TSMC

Subject	Author
Japan approves chip development project with Taiwan's TSMC	World90